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THREE PILLARS

One integrated
Sion hardware
stack.

Each pillar is world-class on its own. Their real power comes from working together under one accountable program — chip to board to system, owned end-to-end by Sion.

PILLAR 1

SILICON IP &
INTEGRATION

Sion delivers expertly-integrated, production-proven IP blocks across the critical building blocks of modern silicon — sourced from our own libraries and qualified technology partners. Every IP is silicon-validated on real tape-outs, not simulation-only.
HIGH-SPEED SERDES

NRZ & PAM4 SERDES

Production-proven high-speed SerDes across 7nm, 5nm, 3nm

PCIE / CXL

Gen5 / Gen6 · CXL 3.0

Root complex, endpoint, switch, and fabric controllers

ETERNET

400G / 800G MAC & PHY

MAC, PCS, FEC, with optional TSN support

MEMORY SUBSYSTEM

HBM3e / DDR5 / LPDDR5X

Controllers, PHY, and memory fabric

NETWORK-ON-CHIP

AI-optimized NoC

Coherent and non-coherent fabric for AI SoCs

STORAGE

NAND ECC & NVMe

ECC engines, NAND interface, computational storage IP

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PILLAR 2

CHIP & SOC
DESIGN

End-to-end silicon engineering from specification through volume production. 24+ production tape-outs and a 120+ engineering team at nodes from 16nm to 3nm — executed by Sion, owned by Sion.
FRONT-END DESIGN

RTL & Architecture

Micro-architecture, RTL coding, low-power design, clock & reset architecture

VERIFICATION

UVM · Formal · Emulation

SystemVerilog/UVM, formal, coverage closure, Palladium/Protium emulation

Physical Design

7nm / 5nm / 3nm PD

Floorplan, P&R, timing/power closure, signoff at advanced nodes

DFT

Design for Test

Scan, MBIST, LBIST, boundary scan, high-speed ATPG closure

Post-Silicon

Bring-up & Validation

Lab bring-up, SerDes tuning, compliance, characterization

NPI & Production

Ramp to Volume

Test program development, yield enhancement, supply-chain partnering

PILLAR 3

Hardware Systems &
Platforms

Sion turns silicon into shippable hardware products — and shippable hardware into rack-ready systems. High-density boards, reference platforms, accelerator cards, firmware, device drivers, chassis integration, and OCP-compliant rack engineering — engineered end-to-end for data-center and edge deployment at scale.
High-Speed Boards

PCIe / CXL / 800G

Signal integrity, impedance control, thermal management

AI Appliances

Deployable AI Systems

Full-rack AI accelerator platforms ready for hyperscaler deployment

Firmware

Embedded & RTOS

SoC firmware, device drivers, bootloaders, secure boot

Compliance

Validation & Testing

PCIe-SIG, CXL Consortium, OCP, UCIe test readiness

✦ System & Rack Integration

Chassis · OCP Racks · BMC · Data-Center-Ready Platforms

Sion extends hardware delivery beyond the card — engineering the full system around it. 1U / 2U / 4U chassis design, OCP & 19″ rack integration, backplane & midplane design, rack-level signal integrity & thermal budgeting, BMC firmware, power sequencing, and cable management. The layer that turns a working card into a deployable, rack-ready platform for AI, storage, and networking customers.

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How Sion Delivers

A proven path from
concept to production-
ready hardware.

PHASE 1

ARCHITECTURE &
FEASIBILITY

Joint architecture review, IP selection, node selection, power/performance/area estimation, and program-risk assessment.

PHASE 2

RTL DESIGN &
VERIFICATION

Micro-architecture, RTL coding, UVM/ SystemVerilog testbench, formal property verification, coverage closure, and optional emulation on Palladium/Protium.

PHASE 3

PHYSICAL DESIGN &
SIGNOFF

Floorplan, placement, CTS, routing, timing closure, power signoff, DRC/LVS, EM/IR closure — all at advanced nodes with full vendor-flow support.

PHASE 4

TAPE-OUT & SILICON
BRING-UP

Foundry interface, mask prep, wafer fabrication monitoring, package design, lab bring-up, SerDes tuning, compliance testing, characterization.

PHASE 5

BOARD, FIRMWARE &
SYSTEM INTEGRATION

High-density board design, firmware development, device drivers, reference platform integration, and system-level bring-up — turning Sion silicon into a shippable hardware product.

PHASE 6

NPI & PRODUCTION
RAMP

Test program development, ATE program optimization, yield enhancement, supply-chain partnering, and ramp to volume — delivering a production-ready hardware solution.

Compliance & IP Security

Your IP is protected.
Your program is
compliant.

We know IP leakage is the single biggest concern for AI and defense-adjacent customers. Sion operates with enterprise-grade process controls, segregated project environments, and clear Chinese-wall protocols on every engagement.

Export-control awareness, ITAR-sensitive handling procedures, and audit-ready data-room practices are built into every Sion engagement — not bolted on.

ISO 27001

Information Security

BIS / EAR

Export Compliance

Chinese Wall

Project Isolation

NDA Framework

Multi-tier IP Controls

Hardware Left
Hardware Right

Let's scope your
hardware program together.

A 30-minute architecture call with a Sion solution architect is the fastest path to a scoped proposal — for a chip, a board, a full system, or all three.