Each pillar is world-class on its own. Their real power comes from working together under one accountable program — chip to board to system, owned end-to-end by Sion.
Production-proven high-speed SerDes across 7nm, 5nm, 3nm
Root complex, endpoint, switch, and fabric controllers
MAC, PCS, FEC, with optional TSN support
Controllers, PHY, and memory fabric
Coherent and non-coherent fabric for AI SoCs
ECC engines, NAND interface, computational storage IP
Micro-architecture, RTL coding, low-power design, clock & reset architecture
SystemVerilog/UVM, formal, coverage closure, Palladium/Protium emulation
Floorplan, P&R, timing/power closure, signoff at advanced nodes
Scan, MBIST, LBIST, boundary scan, high-speed ATPG closure
Lab bring-up, SerDes tuning, compliance, characterization
Test program development, yield enhancement, supply-chain partnering
Signal integrity, impedance control, thermal management
Full-rack AI accelerator platforms ready for hyperscaler deployment
SoC firmware, device drivers, bootloaders, secure boot
PCIe-SIG, CXL Consortium, OCP, UCIe test readiness
Sion extends hardware delivery beyond the card — engineering the full system around it. 1U / 2U / 4U chassis design, OCP & 19″ rack integration, backplane & midplane design, rack-level signal integrity & thermal budgeting, BMC firmware, power sequencing, and cable management. The layer that turns a working card into a deployable, rack-ready platform for AI, storage, and networking customers.
From pre-packaged hardware offerings with same-day quotes to full multi-year strategic partnerships — Sion structures engagements to match your risk, timeline, and commitment profile.
Pre-scoped, pre-priced engagements with clear deliverables. From SilicaBoost™ IP integration to StorageCore™ turnkey controllers — start engineering in weeks, not months.
A ring-fenced Sion engineering team embedded with your program, scaling up and down with your roadmap. Ideal for verification, PD, board design, firmware, or multi-project capacity.
A multi-year, multi-program partnership with shared investment, co-developed IP, and deep executive alignment. Reserved for customers with a long-term hardware roadmap.
Joint architecture review, IP selection, node selection, power/performance/area estimation, and program-risk assessment.
Micro-architecture, RTL coding, UVM/ SystemVerilog testbench, formal property verification, coverage closure, and optional emulation on Palladium/Protium.
Floorplan, placement, CTS, routing, timing closure, power signoff, DRC/LVS, EM/IR closure — all at advanced nodes with full vendor-flow support.
Foundry interface, mask prep, wafer fabrication monitoring, package design, lab bring-up, SerDes tuning, compliance testing, characterization.
High-density board design, firmware development, device drivers, reference platform integration, and system-level bring-up — turning Sion silicon into a shippable hardware product.
Test program development, ATE program optimization, yield enhancement, supply-chain partnering, and ramp to volume — delivering a production-ready hardware solution.
We know IP leakage is the single biggest concern for AI and defense-adjacent customers. Sion operates with enterprise-grade process controls, segregated project environments, and clear Chinese-wall protocols on every engagement.
Export-control awareness, ITAR-sensitive handling procedures, and audit-ready data-room practices are built into every Sion engagement — not bolted on.


A 30-minute architecture call with a Sion solution architect is the fastest path to a scoped proposal — for a chip, a board, a full system, or all three.