NOW OPERATING · SAN JOSE · MUNICH · SINGAPORE · DUBAI · BANGALORE

01 · Vertical

AI
INFRASTRUCTURE

AI is the fastest-growing hardware category of this decade. Every hyperscaler, AI startup, and sovereign-AI program is racing to deploy custom accelerator hardware — and all of them need the same thing: high-performance silicon and systems that work, delivered on time.

Sion specializes in the AI-adjacent hardware that powers this wave — NIC / DPU chips, accelerator cards, CXL platforms, memory expanders, firmware, and the interconnect subsystems that turn AI compute into AI infrastructure.

IDEAL CUSTOMER

AI infrastructure startups (Series B+), hyperscaler Tier-2 suppliers, sovereign-AI programs, and AI systems OEMs building differentiated accelerator hardware.

Interconnects

SerDes

Production-proven in silicon

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Memory Fabric

CXL 3.0

HBM3e · DDR5

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AI-NIC / DPU SOCS
Smart NIC and DPU accelerators with high-speed SerDes and PCIe Gen6
CXL ACCELERATORS
CXL 3.0 memory expanders and pooling controllers for AI memory fabric
POWER ICS
Power management ICs engineered for AI rack-scale deployments
REFERENCE PLATFORMS
Sion-engineered AI accelerator cards and reference appliances
NOC & SUBSYSTEMS
AI-optimized network-on-chip fabric and SerDes subsystems
02 · Vertical

STORAGE &
MEMORY

Enterprise storage is being reshaped by CXL memory, computational storage, and the post-Marvell/Phison second-source opportunity. Mid-tier OEMs need specialist partners who can deliver complete controller hardware without the Tier-1 price tag or the boutique execution risk.

Sion's storage practice is anchored by proven PCIe, DDR, and NAND-interface expertise — built on a decade of silicon, board, and firmware delivery in the storage segment.

IDEAL CUSTOMER

Enterprise SSD OEMs, CXL memory vendors, computational-storage startups, hyperscaler storage teams, and Tier-2 storage hardware challengers.

Storage Fabric

PCIe Gen6

NVMe · CXL 2.0/3.0

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Sales Cycle

6–9 mo

Fast close

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SSD Controllers
Enterprise-grade NVMe controllers with PCIe Gen5/6 and advanced ECC
CXL Memory
CXL 2.0/3.0 memory expanders and pooling controllers
Computational Storage
CSD and CSP silicon with integrated acceleration engines
JBOF / EBOF
Reference platforms for disaggregated storage infrastructure
Firmware
Storage-grade firmware, FTL, and secure-boot integration
03 · Vertical

Networking &
Connectivity

The simultaneous rollout of 400G/800G Ethernet, PCIe Gen6, and CXL 3.0 is creating unprecedented demand for SerDes and interconnect expertise — the #1 scarce skill in global hardware today. Tier-2 OEMs are bringing derivative switch, NIC, and SmartNIC hardware to market faster than incumbents can serve.

Sion's networking practice combines a decade of PCIe, DDR, and Ethernet FPGA credentials with production-proven silicon, board, and firmware expertise — delivered as complete hardware solutions.

IDEAL CUSTOMER

Networking OEMs (Tier-2), SmartNIC vendors, switch ASIC challengers, automotive-Ethernet hardware teams, and regional silicon programs across EU and India.

Line Rates

400/800G

Ethernet MAC/PHY

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Sion Signature

SerDes

Scarcest skill in silicon

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Switch ASICs
400G/800G switch ASIC derivatives for Tier-2 OEMs
NIC / SmartNIC
Programmable NIC SoCs with hardware offload engines
PCIe / CXL Cards
Gen5/Gen6 PCIe and CXL 2.0/3.0 reference cards and adapters
Automotive Ethernet
TSN, 10GBASE-T1, multi-gig automotive connectivity silicon
SerDes Subsystems
NRZ and PAM4 high-speed SerDes integration, bring-up, and validation
04 · Vertical

FPGA-to-ASIC
Conversion

Your product is shipping on FPGA. Volumes are scaling. BOM cost is becoming the limit. The natural next step is converting proven RTL into a cost-optimized, power-efficient ASIC — with a matching production-ready board and firmware — without touching the architecture that your customers already trust.

Sion has deep experience converting FPGA designs (Xilinx / Altera / Intel) running PCIe Gen4, DDR4, Ethernet, and custom high-speed logic into production hardware solutions at 16nm, 12nm, and 7nm.

IDEAL CUSTOMER

Systems OEMs with proven FPGA products shipping 10K+ units/year who want to reduce BOM by 40–60% and power by 50–70%.

BOM Reduction

40–60%

Power cut 50–70%

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Cycle Time

4–6 mo

Lowest risk pathway

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FPGA-ASIC
FPGA-to-ASIC RTL migration & optimization
UVM verification
Full UVM verification suite & coverage closure
DFT insertion
DFT insertion, PD closure, tape-out at 16nm–7nm
Lab
Lab bring-up, compliance, characterization
NPI Test
NPI, test-program development, production ramp
Hardware Left
Hardware Right

Find the right
engagement for your
program.

Tell us about your hardware — chip, board, system, or all three — and a Sion architect will respond within 24 hours with an initial scope framework.